AY

Akira Yamauchi

BC Bondtech Co.: 2 patents #1 of 2Top 50%
UN Unknown: 1 patents #342 of 3,065Top 15%
📍 Kyoto, MI: #7 of 13 inventorsTop 55%
Overall (2023): #177,233 of 537,848Top 35%
2
Patents 2023

Issued Patents 2023

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11837444 Substrate joining method, substrate joining system and method for controlling hydrophilic treatment device Tadatomo Suga 2023-12-05
11587804 Component mounting system 2023-02-21