Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11849566 | Joint structure, electronic device and method for manufacturing the joint structure | Toshihiro Miyake, Eiji Higurashi | 2023-12-19 |
| 11837444 | Substrate joining method, substrate joining system and method for controlling hydrophilic treatment device | Akira Yamauchi | 2023-12-05 |