Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11746003 | Chip package | Chaung-Lin LAI, Shu-Ming Chang | 2023-09-05 |
| 11705368 | Manufacturing method of chip package and chip package | Chia-Sheng Lin, Hui-Hsien Wu, Jian-Hong Chen, Kuei-Wei Chen | 2023-07-18 |