Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784134 | Chip package and manufacturing method thereof | Chia-Ming Cheng | 2023-10-10 |
| 11746003 | Chip package | Tsang-Yu Liu, Chaung-Lin LAI | 2023-09-05 |
| 11749618 | Chip package including substrate having through hole and redistribution line | Chia-Ming Cheng | 2023-09-05 |