Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11823891 | Backside metallized compound semiconductor device and method for manufacturing the same | Tsung-Te CHIU, Houng-Chi Wei, Chia-Chu Kuo, Bing-Han CHUANG | 2023-11-21 |
| 11631601 | Transfer head for transferring micro element and transferring method of micro element | Chen-ke HSU, Jiansen ZHENG, Xiaojuan Shao | 2023-04-18 |