Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11823891 | Backside metallized compound semiconductor device and method for manufacturing the same | Tsung-Te CHIU, Kechuang Lin, Houng-Chi Wei, Bing-Han CHUANG | 2023-11-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11823891 | Backside metallized compound semiconductor device and method for manufacturing the same | Tsung-Te CHIU, Kechuang Lin, Houng-Chi Wei, Bing-Han CHUANG | 2023-11-21 |