Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11839031 | Micro solder joint and stencil aperture design | John P. Burke, Ibrahym bin Ahmad, Fakhrozi Bin Che Ani, Mohamad Solehin Bin Mohamed Sunar, Peir Ming Sing | 2023-12-05 |