Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11839031 | Micro solder joint and stencil aperture design | Ibrahym bin Ahmad, Fakhrozi Bin Che Ani, Mohamad Solehin Bin Mohamed Sunar, Peir Ming Sing, Hari kiran Raavi | 2023-12-05 |
| 11788964 | Analyses of surface-mount-technology components using fluorescent-dye penetrants | Erwan Basiron, Kamarol Azmin Kamaruddin, Muhammad Nizam Bin Ilias | 2023-10-17 |