Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11551991 | Semiconductor device package having cover portion with curved surface profile | Bo Yang, Ning Ye, Shrikar Bhagath | 2023-01-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11551991 | Semiconductor device package having cover portion with curved surface profile | Bo Yang, Ning Ye, Shrikar Bhagath | 2023-01-10 |