Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830849 | Semiconductor device with unbalanced die stackup | Saurabh Nilkanth Athavale, Pradeep Rai | 2023-11-28 |
| 11551991 | Semiconductor device package having cover portion with curved surface profile | Bo Yang, Chun Sean Lau, Ning Ye | 2023-01-10 |
| 11552040 | Package process, DAF replacement | Siqi Zhang, Xu Wang, Pradeep Rai | 2023-01-10 |