AB

Albert Louis Bove

UP Utac Headquarters Pte.: 1 patents #6 of 24Top 25%
📍 Singapore, SG: #469 of 1,808 inventorsTop 30%
Overall (2023): #529,882 of 537,848Top 100%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11676934 Clip bond semiconductor packages and assembly tools Hua Tan, Aaron Tan 2023-06-13