AT

Aaron Tan

UP Utac Headquarters Pte.: 1 patents #6 of 24Top 25%
📍 Cleveland, MS: #1 of 1 inventorsTop 100%
🗺 Mississippi: #71 of 321 inventorsTop 25%
Overall (2023): #535,370 of 537,848Top 100%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11676934 Clip bond semiconductor packages and assembly tools Albert Louis Bove, Hua Tan 2023-06-13