Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11792939 | Substrate with buried component and manufacture method thereof | Chung-Yu Lan | 2023-10-17 |
| 11670520 | Package structure with interconnection between chips and packaging method thereof | Jia-Shiang Chen, Chung-Yu Lan | 2023-06-06 |