Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670520 | Package structure with interconnection between chips and packaging method thereof | Chung-Yu Lan, Yu-Shen Chen | 2023-06-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670520 | Package structure with interconnection between chips and packaging method thereof | Chung-Yu Lan, Yu-Shen Chen | 2023-06-06 |