Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784112 | Integrated circuit package and method to manufacture the integrated circuit package to reduce bond wire defects in the integrated circuit package | Jun Li, Xingshou Pang, Mingchuan Han, Jinzhong Yao, Xuesong Xu | 2023-10-10 |
| 11778296 | Camera module and electronic device having the camera module | JING-WEI LI, DING-NAN HUANG, YU-SHUAI LI | 2023-10-03 |
| 11778295 | Camera module and electronic device having the camera module | SHIN-WEN CHEN, SHENG-JIE DING, JING-WEI LI, DING-NAN HUANG | 2023-10-03 |
| 11733474 | Lens module and electronic device using the same | SHENG-JIE DING, SHIN-WEN CHEN, JING-WEI LI, YU-SHUAI LI | 2023-08-22 |
| 11696009 | Camera module and electronic device having the camera module | SHIN-WEN CHEN, JING-WEI LI, SHENG-JIE DING | 2023-07-04 |
| 11665815 | Lens module of reduced size and electronic device | Long Zhang, JING-WEI LI, SHENG-JIE DING, SHIN-WEN CHEN, DING-NAN HUANG | 2023-05-30 |
| 11582371 | Camera module of reduced size in two dimensions and electronic device including the same | JING-WEI LI, SHENG-JIE DING, YU-SHUAI LI | 2023-02-14 |
| 11579399 | Camera module and electronic device | SHIN-WEN CHEN, JING-WEI LI, SHENG-JIE DING | 2023-02-14 |
| 11543568 | Camera module and electronic device having the camera module | JING-WEI LI, SHENG-JIE DING, YU-SHUAI LI | 2023-01-03 |
| 11546494 | Camera module and electronic device having buffer layer with the optical filter | SHIN-WEN CHEN, SHENG-JIE DING, JING-WEI LI | 2023-01-03 |