Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784112 | Integrated circuit package and method to manufacture the integrated circuit package to reduce bond wire defects in the integrated circuit package | JIAN-CHAO SONG, Jun Li, Xingshou Pang, Jinzhong Yao, Xuesong Xu | 2023-10-10 |