Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11840770 | Film formation apparatus and film formation method for forming metal film | Akira Kato, Soma Higashikozono | 2023-12-12 |
| 11785721 | Method for manufacturing wiring board | Rentaro Mori, Keiji Kuroda, Kazuaki Okamoto, Akira Kato, Jyunya MURAI +3 more | 2023-10-10 |
| 11700686 | Method for manufacturing wiring board | Keiji Kuroda, Kazuaki Okamoto, Rentaro Mori, Hiroshi Yanagimoto | 2023-07-11 |
| 11696410 | Method for producing wiring substrate | Rentaro Mori, Hiroshi Yanagimoto, Keiji Kuroda, Kazuaki Okamoto | 2023-07-04 |
| 11665829 | Method for manufacturing wiring board | Rentaro Mori, Keiji Kuroda, Hiroshi Yanagimoto, Kazuaki Okamoto | 2023-05-30 |
| 11643745 | Film formation device and film formation method for metallic coating | Akira Kato, Soma Higashikozono | 2023-05-09 |