Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11785721 | Method for manufacturing wiring board | Haruki KONDOH, Rentaro Mori, Keiji Kuroda, Akira Kato, Jyunya MURAI +3 more | 2023-10-10 |
| 11700686 | Method for manufacturing wiring board | Keiji Kuroda, Haruki KONDOH, Rentaro Mori, Hiroshi Yanagimoto | 2023-07-11 |
| 11696410 | Method for producing wiring substrate | Haruki KONDOH, Rentaro Mori, Hiroshi Yanagimoto, Keiji Kuroda | 2023-07-04 |
| 11665829 | Method for manufacturing wiring board | Haruki KONDOH, Rentaro Mori, Keiji Kuroda, Hiroshi Yanagimoto | 2023-05-30 |