Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11594431 | Wafer bonding apparatus and methods to reduce post-bond wafer distortion | — | 2023-02-28 |
| 11574808 | Plasma processing method and plasma processing apparatus | Satoshi Itoh, Norifumi Kohama, Soudai EMORI | 2023-02-07 |