Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728279 | Pad structure for enhanced bondability | Ru-Ying Huang, Yung Ching Chen, Yian-Liang Kuo | 2023-08-15 |
YL
Yueh-Chiou Lin
Overall (2023): #188,692 of 537,848Top 40%
1
Patents 2023