Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728279 | Pad structure for enhanced bondability | Yung Ching Chen, Yueh-Chiou Lin, Yian-Liang Kuo | 2023-08-15 |
RH
Ru-Ying Huang
Overall (2023): #273,758 of 537,848Top 55%
1
Patents 2023