Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11667517 | Method and structure for CMOS-MEMS thin film encapsulation | Chia-Hua Chu, Chun-Wen Cheng | 2023-06-06 |
YL
Yu-Chia Liu
Overall (2023): #188,615 of 537,848Top 40%
1
Patents 2023