Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742320 | Wafer bonding alignment | Hsi-Cheng Hsu, Jui-Chun Weng, Ching-Hsiang Hu, Ji-Hong Chiang, Kuo-Hao Lee +4 more | 2023-08-29 |
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Yen-Chieh TU
Overall (2023): #197,748 of 537,848Top 40%
1
Patents 2023