Issued Patents 2023
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854966 | Method of forming semiconductor device including deep vias | Chien-Ying Chen, Li-Chun Tien, Lee-Chung Lu | 2023-12-26 |
| 11824541 | Flip flop standard cell | Nick Samra, Stefan Rusu | 2023-11-21 |
| 11803682 | Semiconductor device including standard cell having split portions | Chien-Ying Chen | 2023-10-31 |
| 11776949 | Integrated circuit device and method | Chien-Ying Chen, Lee-Chung Lu, Li-Chun Tien | 2023-10-03 |
| 11709985 | Semiconductor device including standard cells with combined active region | Guru Prasad | 2023-07-25 |
| 11621703 | Cell of transmission gate free circuit and integrated circuit layout including the same | Chi-Lin Liu, Shang-Chih Hsieh, Jerry Chang Jui Kao, Li-Chun Tien, Lee-Chung Lu | 2023-04-04 |
| 11581314 | Integrated circuits and manufacturing methods thereof | Ali Keshavarzi, Shu-Hui Sung, Hsiang-Jen Tseng, Shyue-Shyh Lin, Lee-Chung Lu +6 more | 2023-02-14 |
| 11574865 | Method of forming semiconductor device including deep vias | Chien-Ying Chen, Li-Chun Tien, Lee-Chung Lu | 2023-02-07 |
| 11557532 | Monolithic 3D integration inter-tier vias insertion scheme and associated layout structure | Carlos H. Diaz, Jean-Pierre Colinge, Yi-Hsiung Lin | 2023-01-17 |