Issued Patents 2023
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11856760 | Bit cell with back-side metal line device and method | Yao-Jen Yang | 2023-12-26 |
| 11854968 | Modified fuse structure and method of use | Meng-Sheng Chang, Yao-Jen Yang | 2023-12-26 |
| 11854966 | Method of forming semiconductor device including deep vias | Ta-Pen Guo, Li-Chun Tien, Lee-Chung Lu | 2023-12-26 |
| 11837539 | Electrical fuse bit cell in integrated circuit having backside conducting lines | Yen-Jen Chen, Yao-Jen Yang, Meng-Sheng Chang, Chia-En Huang | 2023-12-05 |
| 11803682 | Semiconductor device including standard cell having split portions | Ta-Pen Guo | 2023-10-31 |
| 11776949 | Integrated circuit device and method | Lee-Chung Lu, Li-Chun Tien, Ta-Pen Guo | 2023-10-03 |
| 11696437 | Integrated circuit device | Meng-Sheng Chang, Chia-En Huang, Yih Wang | 2023-07-04 |
| 11574865 | Method of forming semiconductor device including deep vias | Ta-Pen Guo, Li-Chun Tien, Lee-Chung Lu | 2023-02-07 |
| 11549796 | Thickness measuring device | Yu-Jen Chang, Ken-Te Chou | 2023-01-10 |