Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11772227 | Device and methods for chemical mechanical polishing | James Jeng-Jyi Hwang, He Hui Peng, Chi-Ming Yang | 2023-10-03 |
| 11602821 | Wafer polishing head, system thereof, and method using the same | James Jeng-Jyi Hwang, He Hui Peng, Chi-Ming Yang | 2023-03-14 |