Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715770 | Forming semiconductor structures with semimetal features | Che-Wei Yang | 2023-08-01 |
| 11626320 | Method for manufacturing semiconductor device, method for packaging semiconductor chip, method for manufacturing shallow trench isolation (STI) | Che-Wei Yang | 2023-04-11 |
| 11605674 | Metal-insulator-semiconductor-insulator-metal (MISIM) device, method of operation, and memory device including the same | Jenn-Gwo Hwu, Chang-Feng Yan, Samuel C. Pan | 2023-03-14 |