Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715770 | Forming semiconductor structures with semimetal features | Hao-Hsiung Lin | 2023-08-01 |
| 11626320 | Method for manufacturing semiconductor device, method for packaging semiconductor chip, method for manufacturing shallow trench isolation (STI) | Hao-Hsiung Lin | 2023-04-11 |