Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742320 | Wafer bonding alignment | Hsi-Cheng Hsu, Jui-Chun Weng, Ching-Hsiang Hu, Ji-Hong Chiang, Kuo-Hao Lee +4 more | 2023-08-29 |
CS
Chien-Tai SU
Overall (2023): #484,276 of 537,848Top 95%
1
Patents 2023