Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545952 | Electronic package including cavity formed by removal of sacrificial material from within a cap | Atsushi Takano, Mitsuhiro Furukawa, Tetsuya Uebayashi | 2023-01-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545952 | Electronic package including cavity formed by removal of sacrificial material from within a cap | Atsushi Takano, Mitsuhiro Furukawa, Tetsuya Uebayashi | 2023-01-03 |