Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11811385 | Bulk acoustic wave component with conductor extending laterally from via | Takeshi Furusawa, Mitsuhiro Furukawa | 2023-11-07 |
| 11581870 | Stacked acoustic wave resonator package with laser-drilled VIAS | Mitsuhiro Furukawa, Takeshi Furusawa | 2023-02-14 |
| 11545952 | Electronic package including cavity formed by removal of sacrificial material from within a cap | Mitsuhiro Furukawa, Ichiro Kameyama, Tetsuya Uebayashi | 2023-01-03 |