Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11687699 | Method for modeling sequence impedance of modular multilevel converter under phase locked loop coupling | Fujin Deng, Yun Zhou, Chengkai Liu, Jianzhong Zhang | 2023-06-27 |