Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11687699 | Method for modeling sequence impedance of modular multilevel converter under phase locked loop coupling | Fujin Deng, Hanlu Zhang, Chengkai Liu, Jianzhong Zhang | 2023-06-27 |
| 11658820 | Workflow for enabling data-in-transit in a distributed system | Wei-Leun Fang, Haoran Zheng, Tao Xie, Yangyang Zhang | 2023-05-23 |