Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11701739 | Method of optimizing laser cutting of wafers for producing integrated circuit dies | Juan Arturo Jerez, Luis Enrique Velazquez Cardenas | 2023-07-18 |
| 11616045 | Methods and apparatuses for removal of wires from packaging substrates | Cesar Melendrez, Aldrin Quinones GARING | 2023-03-28 |