Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11701739 | Method of optimizing laser cutting of wafers for producing integrated circuit dies | Juan Arturo Jerez, Miguel Camargo Soto | 2023-07-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11701739 | Method of optimizing laser cutting of wafers for producing integrated circuit dies | Juan Arturo Jerez, Miguel Camargo Soto | 2023-07-18 |