Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11710728 | Memory device having wafer-to-wafer bonding structure | Je Hyun Choi, Sung Lae OH | 2023-07-25 |
| 11676667 | Memory device having page buffer | — | 2023-06-13 |
| 11636906 | Memory device and method of applying operating voltage | — | 2023-04-25 |
| 11581028 | Memory device for counting fail bits included in sensed data | — | 2023-02-14 |