Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11710728 | Memory device having wafer-to-wafer bonding structure | Sung Lae OH, Soo Yeol CHAI | 2023-07-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11710728 | Memory device having wafer-to-wafer bonding structure | Sung Lae OH, Soo Yeol CHAI | 2023-07-25 |