Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776897 | Electronic module, manufacturing method thereof and electronic package having the same | Ho-Chuan Lin, Chia-Chu Lai | 2023-10-03 |
| 11728234 | Electronic package comprising wire inside an electronic component and manufacturing method thereof | Ho-Chuan Lin, Chia-Chu Lai | 2023-08-15 |