Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776897 | Electronic module, manufacturing method thereof and electronic package having the same | Ho-Chuan Lin, Min-Han Chuang | 2023-10-03 |
| 11728234 | Electronic package comprising wire inside an electronic component and manufacturing method thereof | Ho-Chuan Lin, Min-Han Chuang | 2023-08-15 |
| 11682826 | Electronic package and fabrication method thereof | Chung-Yu Ke, Liang-Pin Chen | 2023-06-20 |
| 11670607 | Electronic package | Chih-Hsien Chiu, Wen-Jung Tsai | 2023-06-06 |