Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11706877 | Composite wiring substrate and semiconductor device | Koyuki Kawakami, Kiyoshi Oi, Kei Murayama, Mitsuhiro Aizawa | 2023-07-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11706877 | Composite wiring substrate and semiconductor device | Koyuki Kawakami, Kiyoshi Oi, Kei Murayama, Mitsuhiro Aizawa | 2023-07-18 |