Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817381 | Semiconductor device | Kei Murayama, Mitsuhiro Aizawa, Amane KANEKO | 2023-11-14 |
| 11706877 | Composite wiring substrate and semiconductor device | Shota Miki, Koyuki Kawakami, Kei Murayama, Mitsuhiro Aizawa | 2023-07-18 |