Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11608438 | Low-dielectric heat dissipation film composition and low-dielectric heat dissipation film | Hiroyuki IGUCHI, Yuki Kudo, Atsushi TSUURA, Yoshihiro TSUTSUMI | 2023-03-21 |
| 11541580 | Method for preparing compact of resin compound having anisotropy | Tetsuo Oka, Takeshi Fukuda | 2023-01-03 |