Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11773100 | Bismaleimide compound and production method thereof | Yuki Kudo | 2023-10-03 |
| 11639410 | Heat-curable resin composition and uses thereof | Hiroki HORIGOME, Shoichi Osada | 2023-05-02 |
| 11608438 | Low-dielectric heat dissipation film composition and low-dielectric heat dissipation film | Hiroyuki IGUCHI, Yoshinori Takamatsu, Yuki Kudo, Atsushi TSUURA | 2023-03-21 |