Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11710646 | Fan-out packaging method and fan-out packaging plate | Chuan Hu, Yingqiang YAN, Yingjun Pi, Junjun Liu, Edward R. Prack | 2023-07-25 |
| 11616030 | Methods for making three-dimensional module | Guobiao ZHANG, Hongyu Yu, Shengming Zhou, Kai-Cheng Chen, Yida Li +1 more | 2023-03-28 |