Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784625 | Packaging method and package structure for filter chip | Chuan Hu, Zhitao CHEN | 2023-10-10 |
| 11710646 | Fan-out packaging method and fan-out packaging plate | Chuan Hu, Yuejin Guo, Yingjun Pi, Junjun Liu, Edward R. Prack | 2023-07-25 |