Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11587972 | Wafer level light-emitting diode array | Jong Min Jang, Jong Hyeon Chae, Joon Sup Lee, Daewoong Suh, Hyun A Kim +1 more | 2023-02-21 |
| 11578383 | Method for manufacturing high-carbon bearing steel and high-carbon bearing steel manufactured therefrom | Jae-Yoon Hwang, Shin-Woong Jeong, Soon-Jae Won, Sang Min Song, Seung Hyun Hong | 2023-02-14 |
| 11560610 | Copper alloy for valve seats | Soon Woo Kwon, Hyun Ki Kim, Chung An Lee, Seung Hyun Hong, Young-Nam Kim | 2023-01-24 |
| 11557696 | Chip-scale package light emitting diode | Jong Kyu Kim, Se Hee Oh, Hyoung Jin Lim | 2023-01-17 |
| 11542573 | Copper alloy for laser cladding valve sheet | Soon Woo Kwon, Chung An Lee, Seung Hyun Hong, Young-Nam Kim | 2023-01-03 |