Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749707 | Chip-scale package light emitting diode | Se Hee Oh, Joon Sub Lee | 2023-09-05 |
| 11557696 | Chip-scale package light emitting diode | Min Woo Kang, Se Hee Oh, Hyoung Jin Lim | 2023-01-17 |