Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791297 | Molded semiconductor package and related methods | Sw Wang, CH CHEW, How Kiat Liew | 2023-10-17 |
| 11562981 | Methods of forming semiconductor packages with back side metal | — | 2023-01-24 |