Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791297 | Molded semiconductor package and related methods | Sw Wang, Eiji KUROSE, How Kiat Liew | 2023-10-17 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791297 | Molded semiconductor package and related methods | Sw Wang, Eiji KUROSE, How Kiat Liew | 2023-10-17 |