Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764109 | Method of forming a through-substrate via and a semiconductor device comprising a through-substrate via | Jochen Kraft, Georg Parteder, Stefan Jessenig, Franz Schrank | 2023-09-19 |
| 11585711 | Capacitive pressure with Ti electrode | Willem Frederik Adrianus Besling, Remco Henricus Wilhelmus Pijnenburg, Kailash Vijayakumar, Alessandro Faes | 2023-02-21 |